Articles
  • Ceramic tile surface defect detection with integrated feature engineering and defect fuse classifier

  • Chi Zhang*

  • Liaocheng Vocational and Technical College, Liaocheng, Shandong, 252000, China

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

References
  • 1. Q. Lu, J. Lin, L. Luo, Y. Zhang, and W. Zhu, Adv. Eng. Inform. 53[8] (2022) 101692.
  •  
  • 2. Y. Sun, T. Wu, Y. Bao, Y. Li, D. Wan, K. Li, and L. He, Int. J. Appl. Ceram. Technol. 19[1] (2022) 604-611.
  •  
  • 3. C. Wang, S. Wang, X. Li, Y. Liu, X. Zhang, Q. Chang, and Y. Wang, Int. J. Appl. Ceram. Technol. 18[3] (2021) 1052-1062.
  •  
  • 4. G. Wan, H. Fang, D. Wang, J. Yan, and B. Xie, Ceram. Int. 48[8] (2022) 11085-11093.
  •  
  • 5. R. Alamsyah and A.D. Wiranata, Sci. Res. J. VII[4] (2019) 41-45.
  •  
  • 6. B. Zorić, T. Matić, and Ž. Hocenski, ISA Trans. 125[6] (2022) 400-414.
  •  
  • 7. X. Yu, Q. Yu, Q. Mu, Z. Hu, and J. Xie, Appl. Sci. 13[21] (2023) 12057.
  •  
  • 8. O. Stephen, U.J. Maduh, and M. Sain, Electronics 11[1] (2021) 55.
  •  
  • 9. S. Ye and L. Sun, J. Phys.: Conf. Ser. 1650[3] (2020) 032045.
  •  
  • 10. K.B. Kim, D.H. Song, and H.J. Park, Indones. J. Electr. Eng. Comput. Sci. 19[3] (2020) 1505-1511.
  •  
  • 11. N.T. Huynh, D.D. Ho, and H.N. Nguyen, Sustainability 15[6] (2023) 5455.
  •  
  • 12. Z. Zhou, Q. Lu, Z. Wang, and H. Huang, Sensors 19[22] (2019) 5000.
  •  
  • 13. K. Wang, Z. Li, and X. Wang, Appl. Sci. 12[3] (2022) 1249.
  •  
  • 14. M.F. Ohemu, Z.O. Zubair, and R.E. Donatus, ATBU J. Sci. Technol. Educ. 10[2] (2022) 170-180.
  •  
  • 15. A. Ravendran and S. Rianmora, J. Comput. Appl. Res. Mech. Eng. 10[2] (2021) 391-404.
  •  
  • 16. J. Wang, G. Yi, S. Zhang, and Y. Wang, Appl. Sci. 11[1] (2020) 283.
  •  
  • 17. H.S. Nogay, T.C. Akinci, and M. Yilmaz, Neural Comput. Appl. 34[2] (2022) 1423-1432.
  •  
  • 18. J. Wang, Z. Wu, W. Hu, C. Song, X. Guo, P. Cao, L. Yang, and Z. Zhu, Investigation on distributed rescheduling with cutting tool maintenance based on nsga-iii in large-scale panel furniture intelligent manufacturing.Journal of Manufacturing Processes, 112(Feb.) (2024) 214-224.
  •  
  • 19. F. Sušac, T. Matić, I. Aleksi, and T. Keser, Bull. Pol. Acad. Sci. Tech. Sci. 69[3] (2021) e137121.
  •  
  • 20. Oglakci, B., et al. "The Effect of Different Polishing Systems on the Surface Roughness of Nanocomposites: Contact Profilometry and SEM Analyses." Operative Dentistry 46[2] (2021) 173-187.
  •  
  • 21. S. Boovaneswari, S. Nirmal, V. Meyappan, and B. Nandakumar, Semicond. Optoelectron. 42[1] (2023) 1082-1095.
  •  
  • 22. W. Qian, X. Yu, W. Xie, L. Zhang, and W. Wu, J. Phys.: Conf. Ser. 2044[1] (2021) 012105.
  •  
  • 23. X. Le, J. Mei, H. Zhang, B. Zhou, and J. Xi, Neurocomputing 408[9] (2020) 112-120.
  •  
  • 24. G.S. Junior, J. Ferreira, C. Millán-Arias, R. Daniel, A.C. Junior, and B.J. Fernandes, Appl. Sci. 11[13] (2021) 6017.
  •  
  • 25. H.R. Ravikumar, Y.K. Sharma, and S. Raghav, Int. J. Innov. Sci. Eng. Technol. 7[2] (2020) 252-263.
  •  
  • 26. K. Avazov, M.K. Jamil, B. Muminov, A.B. Abdusalomov, and Y.I. Cho, Sensors 23[16] (2023) 7078.
  •  
  • 27. S. Gundu and H. Syed, Sensors 23[5] (2023) 2569.
  •  
  • 28. P. Banerjee, A.K. Bhunia, A. Bhattacharyya, P.P. Roy, and S. Murala, Expert Syst. Appl. 113[12] (2018) 100-115.
  •  
  • 29. F. Bianconi, A. Fernández, F. Smeraldi, and G. Pascoletti, J. Imaging 7[11] (2021) 245.
  •  
  • 30. H. Kim, Y. Arisato, and J. Inoue, Unsupervised segmentation of microstructural images of steel using data mining methods. Computational Materials Science. 201[5] (2022) 110855.
  •  
  • 31. G. Lambard, K. Yamazaki, and M. Demura, Generation of highly realistic microstructural images of alloys from limited data with a style-based generative adversarial network. Scientific Reports 13[1] (2023) 566.
  •  
  • 32. L. Abualigah, A. Diabat, S. Mirjalili, M. Abd Elaziz, and A.H. Gandomi, Comput. Methods Appl. Mech. Eng. 376[4] (2021) 113609.
  •  
  • 33. D. Bhatt, C. Patel, H. Talsania, J. Patel, R. Vaghela, S. Pandya, K. Modi, and H. Ghayvat, Electronics 10[20] (2021) 2470.
  •  
  • 34. E. Cumbajin, N. Rodrigues, P. Costa, R. Miragaia, L. Frazão, N. Costa, A. Fernández-Caballero, J. Carneiro, L.H. Buruberri, and A. Pereira, J. Imaging 9[10] (2023) 193.
  •  

This Article

  • 2024; 25(4): 572-588

    Published on Aug 31, 2024

  • 10.36410/jcpr.2024.25.4.572
  • Received on Mar 8, 2024
  • Revised on Apr 26, 2024
  • Accepted on Apr 29, 2024

Correspondence to

  • Chi Zhang

  • Liaocheng Vocational and Technical College, Liaocheng, Shandong, 252000, China
    Tel : 0635-8334969 Fax: 8322030

  • E-mail: zhangchi292@163.com