Shih-Ming Tsenga, Alex
C.H. Leeb,*, Omid Ali Zargarb, Chun-Chieh Huangc,
Jow-Lay Huanga and Horng-Hwa Lub,*
aDepartment of Materials Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan, R.O.C.
bDepartment of Mechanical Engineering, National Chin-Yi University of Technology, Taichung 411030, Taiwan, R.O.C.
cDepartment of Semiconductor and Electro-Optical Engineering, Southern Taiwan University of Science and Technology, Tainan 710301, Taiwan, R.O.C.
This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
This Article2025; 26(6): 1074-1080
Published on Dec 31, 2025
Correspondence toaDepartment of Materials Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan, R.O.C.
bDepartment of Mechanical Engineering, National Chin-Yi University of Technology, Taichung 411030, Taiwan, R.O.C.
Tel : +886-4-23924504 ext 7152 (Alex C.H. Lee, ORCID: 0000-0002-0251-0931)
Tel : +886-4-23924504 ext 7179 (Horng-Hwa Lu)