Articles
  • Effect of composition on the ability to form SiC/SiO2-C composite from rice husk and silica gel

  • Do Quang Minha,b, Tran Van Khaia,b, Huynh Ngoc Minha,b, Nguyen Vu Uyen Nhia,b and Kieu Do Trung Kiena,b,*

  • aFaculty of Materials Technology, Ho Chi Minh City University of Technology, 268 Ly Thuong Kiet street, Ward 14, District 10, Ho Chi Minh City, Vietnam
    bVietnam National University Ho Chi Minh City, Linh Trung Ward, Thu Duc District, Ho Chi Minh City, Vietnam

  • This article is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

References
  • 1. R. Yuvakkumar, V. Elango, V. Rajendran, and N. Kannan, J. Exp. Nanosci. 9[3] (2014) 272-281.
  •  
  • 2. A.U. Rehman, J.B. Lee, A. Qudoos, S.H. Jakhrani, H.G. Kim, and J.S. Ryou, J. Ceram. Process. Res. 20[3] (2019) 270-275.
  •  
  • 3. A. Yazdani, H.R. Rezaie, H. Ghassai, and M. Mahmoudian, J. Ceram. Process. Res. 14[1] (2013) 12-16.
  •  
  • 4. A. Yazdani, H.R. Rezaie, and H. Ghassai, J. Ceram. Process. Res. 11[3] (2010) 348-353.
  •  
  • 5. J. Zhang, L.M. Postovit, D. Wang, R. Gardiner, R. Harris, M. abdul, and A. A. Thomas, , Nanoscale Res. Lett. 4[11] (2009) 1297-1302.
  •  
  • 6. S. P. B. de Lima, R. P. de Vasconcelos, O. A. Paiva, G. C. Cordeiro, M. R. de Morais Chaves, R. D. Toledo Filho, and E. de Moraes Rego Fairbairn, Quim. Nova 34[1] (2011) 71-75.
  •  
  • 7. H. Moayedi, B. Aghel, M.A.M. Abdullahi, H. Nguyen, and A.S.A Rashid, J. Clean. Prod. 237 (2019) 117851.
  •  
  • 8. A. A. M. Fazli, S. K. Zakaria, N. I. N. A. Rahman, S. Z. Salleh, A. H. Yusoff, N. A. Salleh, M. A. A. Tailb, F. Budiman, A. Ali, and P. T. Teo, J. Ceram. Process. 21[6] (2020) 667-682.
  •  
  • 9. S. Cui, S. Yu, B. Lin, X. Shen, and D. Gu, RSC Adv. 5[81] (2015) 65818-65826.
  •  
  • 10. Y.K. Akimov, Instrum. Exp. Tech. 46[3] (2003) 287-299.
  •  
  • 11. S. Sultana, M.M. Rahman, Z. Yeasmin, S. Ahmed, and F.K. Rony, J. Ceram. Process. Res. 21[3] (2020) 285-295.
  •  
  • 12. W. Weng, S. Wang, W. Xiao, and X.W.D. Lou, Adv. Mater. 32[29] (2020) 2001560.
  •  
  • 13. N.S. Ghafoorian, A.R. Bahramian, and M.M. Seraji, Mater. Design 86 (2015) 279-288.
  •  
  • 14. T. Chanadee, J. Ceram. Process. Res. 18[5] (2017) 389-393.
  •  
  • 15. F. Christin, Adv. Eng. Mater. 4[12] (2002) 903-912.
  •  
  • 16. W. Krenkel and F. Berndt, Mat. Sci. Eng. A-Struct. 412[1-2] (2005) 177-181.
  •  
  • 17. W. Krenkel, B. Heidenreich, and R. Renz, Adv. Eng. Mater. 4[7] (2002) 427-436.
  •  
  • 18. Z. Li, P. Xiao, B.G. Zhang, Y. Li, Y.H. Lu, and S.H. Zhu, Int. J. Appl. Ceram. Technol. 13[3] (2016) 423-433.
  •  
  • 19. H. Hocheng, N.H. Tai, and C.S. Liu, Compos. Part A-Appl. Sci. Manufac.. 31[2] (2000) 133-142.
  •  
  • 20. J.H. Choi, S. Kim, S.H. Kim, I.S. Han, Y.H. Seong, and H.J. Bang, J. Ceram. Process. Res. 20[1] (2019) 48-53.
  •  
  • 21. Y. Zhang, L. Zhang, L. Cheng, H. Mei, Q. Ke, and Y. Xu, J. Ceram. Process. Res. 10[3] (2009) 248-256.
  •  
  • 22. R.V. Krishnarao, Y.R. Mahajan, and T.J. Kumar, J. Eur. Ceram. Soc. 18[2] (1998) 147-152.
  •  
  • 23. R. Dhiman, E. Johnson, and P.J.C.I. Morgen, Ceram. Int. 37[8] (2011) 3759-3764.
  •  
  • 24. V.H. Le, C.N.H. Thuc, and H.H. Thuc, Nanoscale Res. Lett. 8[1] (2013) 58-68.
  •  
  • 25. G.N. Yushin, Z.G. Cambaz, Y. Gogotsi, K.L. Vyshnyakova, and L.N. Pereselentseva, J. Am. Ceram. Soc. 91[1] (2007) 83-87.
  •  
  • 26. J.J. Biernacki and G.P. Wotzak, J. Am. Ceram. Soc. 72[1] (1989) 122-129.
  •  
  • 27. F.K.V. Dijen and R. Metselaar, J. Eur. Ceram. Soc. 7[3] (1991) 177-184.
  •  
  • 28. T. Holopainen, L. Alvila, J. Rainio, and T. Pakkanen, J. Appl. Polym. Sci. 69[11] (1998) 2175-2185.
  •  
  • 29. A.A. Taha and S.A.A. Ghani, J. Dispersion Sci. Technol. 37[2] (2016) 173-182
  •  
  • 30. J. Huang, M. Xu, Q. Ge, M. Lin, Q. Lin, Y. Chen, J. Chu, L. Dai, and Y. Zou, J. Appl. Polym. Sci. 97[2] (2005) 652-658.
  •  
  • 31. J. Cheriaa, M. Khaireddine, M. Rouabhia, and A. Bakhrouf, Sci. World J. 2012 (2012) 512454.
  •  
  • 32. V. Martínez, M.F. Valencia, J. Cruz, J.M. Mejía, and F. Chejne, Ceram. Int. 32[8] (2006) 891-897.
  •  
  • 33. J. Bange, L. Patil, and D.K.Gautam, Prog. Electromagn. Res. M 3 (2008) 165-175.
  •  
  • 34. R. Dong, L. Wang, J. Zhu, L. Liu, and Y. Qian, Appl. Phys. A: Mater. Sci. Process. 125[8] (2019) 551.
  •  
  • 35. K. Sujirote and P. Leangsuwan, J. Mater. Sci. 38[23] (2003) 4739-4744.
  •  
  • 36. Y. Shinohara and N. Kohyama, Ind. Health 42[2] (2004) 277-285.
  •  
  • 37. R.A. Bakar, R. Yahya, and S.N. Gan, Procedia Chem. 19 (2016) 189-195
  •  
  • 38. D.M. Ibrahim and M. Helmy, Thermochim. Acta 45[1] (1981) 79-85.
  •  
  • 39. N.C. Chen, W.H. Wu, Z. Li, and A.P. Deng, Mater. Sci. Forum 686 (2011) 692-695.
  •  
  • 40. I. Markovska and L. Lyubchev, J. Therm. Anal. Calorim. 89[3] (2007) 809-814.
  •  
  • 41. S. Somiya, in “Handbook of Advanced Ceramics: Materials, Applications, Processing, and Properties (Academic Press: Elsevier, 2013).
  •  
  • 42. M.A. Azmi, N.A.A. Ismail, M. Rizamarhaiza, W.M. Hasif. A.A.K., and H. Taib, in Proceedings of the AIP Conf. Proc. 1756 (2016) 020005.
  •  
  • 43. M. Salvatore, G. Carotenuto, S.D. Nicola, C. Camerlingo, V. Ambrogi, and C. Carfagna, Nanoscale Res. Lett. 12 (2017) 167.
  •  
  • 44. V.V. Pujar and J.D. Cawley, J. Am. Ceram. Soc. 78[3] (1995) 774-782.
  •  
  • 45. S. Henke, B. Stritzker, and B. Rauschenbach, J. Appl. Phys. 78[3] (1995) 2070-2073.
  •  
  • 46. A.L. Ortiz, F.S. Bajo, F.L. Cumbrera, and F. Guiberteau, Mater. Lett. 49[2] (2001) 137-145.
  •  
  • 47. J. Aguilar, J. Rodríguez, and M. Hinojosa, J. Microw. Power Electromagn. Energ. 36[3] (2001) 169-177.
  •  
  • 48. B.V.R. Bhat and G.P. Sanghi, Bull. Mater. Sci. 9[4] (1987) 295-303.
  •  

This Article

  • 2021; 22(2): 246-251

    Published on Apr 30, 2021

  • 10.36410/jcpr.2021.22.2.246
  • Received on Dec 20, 2020
  • Revised on Feb 11, 2021
  • Accepted on Mar 2, 2021

Correspondence to

  • Kieu Do Trung Kien

  • aFaculty of Materials Technology, Ho Chi Minh City University of Technology, 268 Ly Thuong Kiet street, Ward 14, District 10, Ho Chi Minh City, Vietnam
    bVietnam National University Ho Chi Minh City, Linh Trung Ward, Thu Duc District, Ho Chi Minh City, Vietnam
    Tel : +(84.8) 8 661 320 Fax: +(84.8) 8 661 843

  • E-mail: kieudotrungkien@hcmut.edu.vn