A micro-conductive pattern was fabricated on an insulating substrate (SiO2) surface using a direct laser writing method known as laser-induced forward transfer (LIFT). The LIFT process, employing a multi-scan mode laser, fabricated the microconductive pattern using an electroless nickel plating procedure as a method for improving the deposition process of the seed pattern on the insulating substrate surface and the electrical conductivity of the pattern. In the multi-scan mode LIFT process, when the laser beam irradiates a thin metal film, the photon energy is absorbed by the film and converted into thermal energy, and the thermal decomposition reaction produced by the resulting heat conduction forms a deposit on the substrate. This paper analyzes the impact of seed pattern formation by LIFT, and the impact of key variables in the electroless nickel plating process, on the micro-conductive pattern fabrication, using scanning electron microscopy (SEM) and an optical microscope. It also examines the impact of the process variables on the cross-sectional shape and surface quality of the deposited pattern.

Keywords: Laser induced forward transfer (LIFT), Laser direct writing, Microdeposition, Electroless nickel plating, Deed layer, Micro patterning.