Shim-Hoon Yuka, Hyun-Gwon Parka, V.
Janardhanama, Kyu-Hwan Shima, Sung-Nam Leeb
and Chel Jong Choia,*
aSchool of Semiconductor and Chemical Engineering,
Semiconductor Physics Research Center (SPRC) Chonbuk National University,
Jeonju 561-756, Republic of Korea
bDepartment of Nano-Optical Engineering, Korea Polytechnic
University, Siheung 429-793, Republic of Korea
We have investigated
microstructural and electrical properties of self-aligned Ni-InGaAs alloy used
as contact material to InGaAs as a function rapid thermal annealing (RTA)
temperature. The Ni-InGaAs alloy was the only phase resulting from solid-state
reaction between Ni and InGaAs, regardless of the RTA temperature.
Microstructural evolutions of Ni-InGaAs and overlaid Ni films were observed for
increasing RTA temperature. The increase in RTA temperature resulted in
increasing the size of the pinholes formed in the Ni film, which could be
associated with the columnar growth nature of sputter-deposited Ni film. A
relatively uniform Ni-InGaAs layer was formed after RTA at 300 oC,
which could be responsible for the minimum specific contact resistivity
observed at this temperature. Above this temperature, the Ni-InGaAs layer
underwent severe structural degradation such as the formation of microvoids in
its surface area, leading to a rapid increase in specific contact resistivity.
Keywords: InGaAs, Ni, Specific contact resistivity, RTA, Solid-state reaction
2020; 21(S1): 53-57
Published on May 31, 2020
School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center (SPRC) Chonbuk National University, Jeonju 561-756, Republic of Korea
Tel : +82-63-270-3365
Fax: +82-63-270-3585