Articles
  • Preparation and properties of coated silica/aluminum cermet materials via powder metallurgy method

  • Jieguang Songa,b,*, Yue Liub, Chunxiao Wua,*, Xueqing Yangb, Huihui Luob, Chunyan Heb, Chengbin Lib and Haizhen Yangb

  • aEngineering Technology Research Center for Sponge City of Pingxiang City, Pingxiang University, Pingxiang 337055 China
    bKey laboratory for Industrial Ceramics of Jiangxi Province, School of Materials and Chemistry Engineering, Pingxiang University, Pingxiang 337055 China

Abstract

Cermet is a combination of metal and ceramic, it exhibits some special properties, so it is one of the most widely used engineering materials. In this paper, the properties of encapsulated SiO2/Al cermet were prepared by powder metallurgy method. Results showed that the density of SiO2/Al cermet is increased with an increasing Al content. When the Al content is high, and the high temperature is sintered, the liquid phase can fully bond the surrounding SiO2 particles to form a relatively continuous and dense structure, thereby obtaining a high microstructure density. When the SiO2:Al ratio is increased from 1:1 to 1:3, the hardness is gradually increased. The hardness and density of the sample are gradually increased with an increasing molding pressure. The surface hardness of the cermet is increased first and then decreased with an increasing sintering temperature. When the SiO2:Al ratio is 1:3, the holding time is 10 min under molding pressure of 15 MPa, and the sintering temperature is 900 °C for 1 h, the surface hardness of the obtained coated SiO2/Al cermet is high, the value is 175.2 HV.


Keywords: Cermet, aluminum, silica, surface hardness, powder metallurgy method

This Article

Correspondence to

  • Jieguang Song a,b,*, Yue Liub, Chunxiao Wu a,*

  • aEngineering Technology Research Center for Sponge City of Pingxiang City, Pingxiang University, Pingxiang 337055 China 
    bKey laboratory for Industrial Ceramics of Jiangxi Province, School of Materials and Chemistry Engineering, Pingxiang University, Pingxiang 337055 China
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